The black and white conductive hemming film is a super strong, foldable, and highly conductive carbon nanotube film, including excellent mechanical, electrical and thermal properties. It is a transparent conductive film uniformly prepared by physical or chemical coating methods.
The black and white conductive hemming film is composed of three structures: the outermost is a protective hardened layer (the hardened layer provides protection for the conductive film to avoid scratches caused during daily use. This layer is currently generally used with UV coatings. Preparation), in the middle is the supporting substrate layer (the substrate provides support for the conductive film, and provides sufficient mechanical strength and dimensional stability, and most of the mechanical properties of the conductive film are provided by this layer. Currently, PET is usually used as the base material.), the innermost is the conductive layer (the conductive layer provides the conductive film with electrical properties and reliability during use).

A promising new concept is the use of flexible black and white conductive hemming films in wearable electronic devices, which mainly use silver nanowires, carbon nanotubes and graphene as conductive materials. But their inadequate nanostructure contact leads to poor electrical conductivity and mechanical fracture. In the unique structure of the black and white conductive hemming film, the inverted pyramid on the film surface can provide enough buffer space for mechanically foldable and non-foldable cushions, and the continuous film can ensure an uninterrupted electronic transmission path. Silver film can exhibit extremely high conductivity, with sheet resistance as low as 2.55×10–3Ω/sq, which is equivalent to a conductivity of 4.2×105 S cm–1 -thick film at 9.2μm).    
Black and white conductive hemming film is widely used in optoelectronic thin film devices and integrated circuits. It is the main electrode film and wire film. The six main requirements for electrode films in the industry are:    
1. Good conductivity, low square resistance    
2. Good adhesion to the substrate or front film    
3. Small contact resistance    
4. Easy to perform micro processing    
5. Has good welding performance    
6. Good stability